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chr3693 - qdg rohs compliant ref. : dschr3693qdg2181 - 29 jun 12 1 / 14 specifications subject to change without notice united monolithic semiconductors s.a.s. bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 21 - 26.5ghz integrated down converter gaas monolithic microwave ic in smd package description the chr3693 - qdg is a multifunction chip, which integrates a balanced cold f et mixer, a time two multiplier, and a rf self biased lna. it is designed for a wide range of applications, typically commercial communication systems. the circuit is manufactured with a phemt process, 0.25m gate length, via holes through the substrate and air bridges. it is supplied in lead - free smd package. main features conversion gain (inf. & sup. mode) broadband performance 21 14db gain 18dbc image rejection 24lqfn4x4 msl level main electrical characteristics tamb.= +25c, vdx=vdl=4.0v, vgx= - 0.9v, vgm= - 0.7v symbol parameter min typ max unit f_rf rf frequency range 21 26.5 ghz f_lo lo frequency range 9 14 ghz f_if if frequency range dc 3.5 ghz gc conversion gai n 12 14 db esd protection: electrostatic discharge sensitive device. observe handling precautions! ums r3693 yyww ? ? ums a3667a yywwg ums a3667a yywwg ums a3688a yywwg ums a3667a yywwg ums a3667a yywwg ums a3688a yywwg f_fi=3ghz f_fi=2ghz q (supradyne) i ( infradyne ) f_fi=3ghz f_fi=2ghz q (supradyne) i ( infradyne ) f_fi=3ghz f_fi=2ghz q (supradyne) i ( infradyne ) f_fi=3ghz f_fi=2ghz q (supradyne) i ( infradyne )
chr3693 - qdg 21 - 26.5ghz integrated down converter ref. : dschr3693qdg2181 - 29 jun 12 2 / 14 s pecifications subject to change without notice bat. charm ille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 electrical characteristics tamb.= +25c, vdx=vdl = +4.0v, vgx= - 0.9v, vgm= - 0.7v symbol parameter min typ max unit f_rf rf frequency range 21 26.5 ghz f_lo lo frequency range 9 14 ghz f_if if frequency range dc 3.5 ghz gc conversion gain 12 14 db nf noise figure for if>0.1ghz 2 2.5 db p_lo lo input power 2 5 dbm img sup image suppression (1) 15 18 dbc iip3 input ip3 - 2 dbm lo_rl lo return loss - 9 - 7 db rf_rl rf return loss (21 to 24ghz) rf return loss (24 to 26.5ghz) - 12 - 8 - 7 - 6 db db lo/rf isolation lo ? ? (2) (idl + idx) 120 160 200 ma (1) with external i/q 90 hybrid c oupler (2) typically, idl= 90ma, idx=70ma these values are representative of onboard measurements as defined on the drawing at paragraph evaluation mother board. absolute maximum ratings (1) tamb.= +25c symbol parameter values unit vd max imum drain bias voltage 4.5 v id maximum drain bias current 230 ma vg gate bias voltage - 2.0 to +0.4 v p_rf maximum rf input power (2) 10 dbm p_lo maximum lo input power (2) 10 dbm tch maximum channel temperature 175 c ta operating temperature range - 40 to +85 c tstg storage temperature range - 55 to +150 c (1) operation of this device above anyone of these parameters may cause permanent damage. (2) duration < 1s.
21 - 26.5ghz integrated down converter chr3693 - qdg ref. : dschr3693qdg2181 - 29 jun 12 3 / 14 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 device thermal performances all the figures given in this section are obtained a ssuming that the qfn device is cooled down only by conduction through the package thermal pad (no convection mode considered). the temperature is monitored at the package back - side interface (tcase) as shown below. the system maximum temperature must be ad justed in order to guarantee that tcase remains below than the maximum value specified in the next table. so, the system pcb must be designed to comply with this requirement. a derating must be applied on the dissipated power if the tcase temperature can not be maintained below than the maximum temperature specified (see the curve pdiss. max) in order to guarantee the nominal device life time (mttf). example : qfn 16l 3x3 location of temperature reference point (tcase) on packages bottom side recommended max. junction temperature (tj max) : 124 c junction temperature absolute maximum rating : 175 c max. continuous dissipated power (pdiss. max.) : 0.64 w => pdiss. max. derating above tcase (1) = 85 c : 16 mw/c junction-case thermal resistance (rth j-c) (2) : <60 c/w minimum tcase operating temperature (3) : -40 c maximum tcase operating temperature (3) : 85 c minimum storage temperature : -55 c maximum storage temperature : 150 c (1) derating at junctio n temperature co nstant = tj max. (2) rth j-c is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the m m ic and all the devices biased. (3) tcase=p ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 6.4 device thermal specification : product name 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 - 50 - 25 0 25 50 75 100 125 150 pdiss. max. @tj chr3693 - qdg 21 - 26.5ghz integrated down converter ref. : dschr3693qdg2181 - 29 jun 12 4 / 14 s pecifications subject to change without notice bat. charm ille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical board measurements tamb=25c, vdx=vdl=4v, typical vgx= - 0.9v & vgm= - 0.7v p_lo=2dbm, f_if =2ghz these values are representative of onboard measurements as defined on the drawing at page 12 (paragraph evaluation mother board) (in connector access planes). conversion gain in infradyne mode versus frequency f_rf = 2xf_lo - f_if conversion gain in supradyne mode versus frequency f_rf = 2xf_lo+f_if - 40c +25c +80c - 40c +25c +80c
21 - 26.5ghz integrated down converter chr3693 - qdg ref. : dschr3693qdg2181 - 29 jun 12 5 / 14 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical board measurements tamb=25c, vdx=vdl=4v, typical vgx= - 0.9v & vgm= - 0.7v p_lo=2dbm, f_if=2ghz image frequency rejection (inf. & sup. mode) @ - 40, +25, +80c - 40 c +25 c +80 c q (supradyne) i ( infradyne ) - 40 c +25 c +80 c q (supradyne) i ( infradyne ) q (supradyne) i ( infradyne )
chr3693 - qdg 21 - 26.5ghz integrated down converter ref. : dschr3693qdg2181 - 29 jun 12 6 / 14 s pecifications subject to change without notice bat. charm ille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical b oard measurements tamb=25c, vdx=vdl=4v, typical vgx= - 0.9v & vgm= - 0.7v p_lo=2dbm, f_if=2ghz board losses have been de - embedded (results in package access planes) noise figure in infradyne mode versus frequency f_rf = 2xf_lo - f_if noise figure in sup radyne mode versus frequency f_rf = 2xf_lo+f_if 0 1 2 3 4 5 20 21 22 23 24 25 26 noise figure (db) frequency (ghz) nf lsb @+85 c nf lsb @+25 c nf lsb @ - 40 c 0 1 2 3 4 5 20 21 22 23 24 25 26 noise figure (db) frequency (ghz) nf usb @+85 c nf usb @+25 c nf usb @ - 40 c
21 - 26.5ghz integrated down converter chr3693 - qdg ref. : dschr3693qdg2181 - 29 jun 12 7 / 14 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical board measurements tamb=25c, vdx=vdl=4v, typical vgx= - 0.9v & vgm= - 0.7v p_lo=2dbm compression versus prf (infradyne and supradyne modes) f_rf=21ghz & f_if=3ghz compression versus prf (i nfradyne and supradyne modes) f_rf=26ghz & f_if=2ghz q (supradyne) i ( infradyne ) +25 c - 40 c +80 c q (supradyne) i ( infradyne ) q (supradyne) i ( infradyne ) +25 c - 40 c +80 c q (supradyne) i ( infradyne ) +25 c - 40 c +80 c q (supradyne) i ( infradyne ) q (supradyne) i ( infradyne ) +25 c - 40 c +80 c
chr3693 - qdg 21 - 26.5ghz integrated down converter ref. : dschr3693qdg2181 - 29 jun 12 8 / 14 s pecifications subject to change without notice bat. charm ille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical board measurements tamb=25c, vdx=vdl=4v, typical vgx= - 0.9v & vgm= - 0.7v input ip3 versus rf power p_lo=2dbm, f_fi=2ghz isolations lo/rf & 2lo/rf p_lo=2, 4 & 6dbm isolation lo - rf isolation 2lo - rf p lo =2dbm p lo = 4dbm p lo =6dbm -6 -5 -4 -3 -2 -1 0 1 -25 -24 -23 -22 -21 -20 -19 -18 -17 -16 -15 p_rf 2tones (dbm) iip3 (dbm) 21ghz @ -40c 23.6ghz @ -40c 26.5ghz @ -40c 21ghz @ 25c 23.6ghz @ 25c 26.5ghz @ 25c 21ghz @ 80c 23.6ghz @ 80c 26.5ghz @ 80c
21 - 26.5ghz integrated down converter chr3693 - qdg ref. : dschr3693qdg2181 - 29 jun 12 9 / 14 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 typical boar d measurements tamb=25c, vdx=vdl=4v, typical vgx= - 0.9v & vgm= - 0.7v lo return loss @ p_lo=0dbm lo freq (ghz) rf return loss @ p_rf= - 30dbm rf freq (ghz)
chr3693 - qdg 21 - 26.5ghz integrated down converter ref. : dschr3693qdg2181 - 29 jun 12 10 / 14 s pecifications subject to change without notice bat. charm ille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 package outline (1) matt tin, lead free (green) 1 - nc 9 - vdx 17 - gnd (2) units : m m 2 - gnd (2) 10 - nc 18 - nc from the standard : jedec mo - 220 3 - gnd (2) 11 - nc 19 - i - if out (vggd) 4 - rf in 12 - vgx 20 - gnd (2) 25 - gnd 5 - gnd (2) 13 - gnd (2) 21 - gnd (2) 6 - gnd (2) 14 - gnd (2) 22 - q - if out 7 - vdl 15 - lo in 23 - nc 8 - vgm 16 - gnd (2) 24 - nc (1) the package outline drawing included to this data - sheet is given for indication. refer to the application note an0017 ( http://www.ums - gaas.com ) for exact package dimensions. (2) it is strongly recommended to ground all pins marked gnd through the pcb board.
21 - 26.5ghz integrated down converter chr3693 - qdg ref. : dschr3693qdg2181 - 29 jun 12 11 / 14 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 definition of the sij reference planes the reference planes used for sij measurements given above are sy mmetrical from the symmetrical axis of the package (see drawing beside). the input and output reference planes are located at 3.18mm offset (input wise and output wise respectively) from this axis. then, the given sij parameters incorporate the land patter n of the evaluation motherboard recommended in paragraph "evaluation mother board". 3.18 3.18
chr3693 - qdg 21 - 26.5ghz integrated down converter ref. : dschr3693qdg2181 - 29 jun 12 12 / 14 s pecifications subject to change without notice bat. charm ille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 evaluation mother board
21 - 26.5ghz integrated down converter chr3693 - qdg ref. : dschr3693qdg2181 - 29 jun 12 13 / 14 specifications subject to change without notice bat. charmille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 note
chr3693 - qdg 21 - 26.5ghz integrated down converter ref. : dschr3693qdg2181 - 29 jun 12 14 / 14 s pecifications subject to change without notice bat. charm ille - parc silic - 10, avenue du qubec - 91140 villebon - sur - yvette - france tel.: +33 (0) 1 69 86 32 00 - fax: +33 (0) 1 69 86 34 34 recommended package footprint refer to the application note an0017 available at http://www.ums - gaas.com for package foot print recommendations. smd mounting proced ure for the mounting process standard techniques involving solder paste and a suitable reflow process can be used. for further details, see application note an0017. recommended environmental management ums products are compliant with the regulation in particular with the directives rohs n2011/65 and reach n1907/2006. more environmental data are available in the application note an0019 also available at http://www.ums - gaas.com . recommended esd management refe r to the application note an0020 available at http://www.ums - gaas.com for esd sensitivity and handling recommendations for the ums package products. ordering information qfn 4x4 ro hs compliant package: chr3693 - qdg /xy stick: xy = 20 tape & reel: xy = 21 information furnished is believed to be accurate and reliable. however united monolithic semiconductors s.a.s. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of united monolithic se miconductors s.a.s. . specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. united monolithic semiconductors s.a.s. products are not authorised for us e as critical components in life support devices or systems without express written approval from united monolithic semiconductors s.a.s.

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